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As computing power and power density increase, the challenges of thermal management, signal integrity, and reliability grow—often while maintaining the same form factor. nVent addresses this issue with a holistic approach that jointly optimizes mechanical protection, thermal management, signal integrity, and power distribution.
Highlight: Cooling and Power Distribution
Two product lines are among the trade show highlights. The „Easy Swap LFT“-platform integrates liquid cooling into standard, pluggable electronic boards without altering their layout. With up to three slots, it supports more than 200 W per slot. The VPX-LFT models, compliant with VITA-48.2, deliver at least 150 W per slot for use in harsh environments. The Smart DCDU enables intelligent -48 V DC power distribution with real-time monitoring, circuit-level transparency, proactive alerts, and a cybersecurity-focused design. This allows problems to be detected before they impact availability, and technicians receive targeted diagnostic data.
Cooling and power management go hand in hand. Advanced cooling enables higher power densities, and intelligent power distribution delivers power where it’s needed. Together, they form the foundation for reliable, efficient, and protected electronics.
nVent is aimed at developers of AI applications, industrial systems, and communications infrastructure. The new, rugged VPX embedded system—with its outstanding signal integrity, optimal cooling, and EMI shielding—is designed to impress, particularly in rail and defense applications that are exposed to extreme conditions.
